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Comparison ledger

-407B-1-S-CES293 Robotversus6220

ABM -407B-1-S-CES293 Robot, KLA 6220, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
6220KLA
OEMABMKLA
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyABM -407B-1-S-CES293 RobotKLA 6220
Specifications
ModelABM-407B-1-S-CES293[1]6220[2]
DescriptionROBOT[1]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
Inspection type—Particle inspection system[3]
Wafer sizes—2", 3", 4", 6", and 8" wafers capable[3]
Illumination source—30 mW argon-ion laser, 488 nm wavelength[3]
Throughput—100 wph (200 mm) at 0.12 mm[3]
Sensitivity—90 nm sensitivity, >80% capture rate[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]Equipment inventory listing
  3. [3]classoneequipment.comclassoneequipment.com
  4. [4]gsemi.comgsemi.com