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Comparison ledger

HRG 200 Xversus20 36 Surface

Accretech HRG 200 X, Blanchard 20 36 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
HRG 200 XAccretech
20 36 SurfaceBlanchard
OEMAccretechBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech HRG 200Blanchard 20 36 Surface
Specifications
Grinding Wheel Diameter250 mm[1]—
Grinding Wheel Spindle SpeedMax. 3600 rmp[1]—
Working Spindle Speed800 rpm[1]—
Motor Power6.3 KW[1]—
Wafer Sizes2, 3, 4, 5, 6, 8 inch[1]—
Wafer Size Range2-inch to 8-inch wafers[2]—
Machine TypeFully Automatic High Rigid 2-Axis Grinder[3]—
Configuration—With new Elecro-Matic Neutrol II Magnetic Chuck Control[4]
Magnetic Chuck Control—Electro-Matic Neutrol II[4]
Type—surface grinder[4]
Application—dicing and grinding[5]
Magnetic chuck control—Electro-Matic Neutrol II Magnetic Chuck Control[5]
Condition note—low hours[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]accretech.comaccretech.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com