Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF200, Disco DCS1440, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF200Accretech | DCS1440Disco |
|---|---|---|
| OEM | Accretech | Disco |
| Category | — | — |
| Wafer size | Wafer Equipment | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF200 | Disco DCS1440 |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | — |
| Date of Manufacture | 1998[1] | — |
| Currently Configured for | 200mm[1] | — |
| Current Equipment Status | Available[1] | — |
| Available date | Currently Available[1] | — |
| Equipment category | Production Wafer Prober[1] | — |
| Mentioned function | — | atomizing cleaning[2] |
| Associated equipment | — | DAG810 automatic surface grinder[2] |
| Maximum workpiece size | — | Φ8 inch[3] |
| Application frame | — | 2-8-1[4] |
| Table RPM | — | 100 to 3,000 min⁻¹[3] |
| Setting time for cleaning/drying | — | 0 to 999 sec[3] |
| Cleaning nozzle speed | — | 1 to 37.5 °/sec[3] |
| Cleaning range | — | Φ365 mm (up to 250×250 mm)[3] |
| Cleaning pressure range | — | 2.3 to 11.8 MPa[3] |
| Equipment dimensions (W×D×H) | — | 400 × 600 × 1,220 mm[3] |
| Dry mass | — | Approx. 124 kg[3] |
| Maximum square workpiece (optional) | — | 250×250 mm[3] |