Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF200, SUSS MicroTec ACS300 Gen3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF200Accretech | ACS300 Gen3SUSS MicroTec |
|---|---|---|
| OEM | Accretech | SUSS MicroTec |
| Category | — | — |
| Wafer size | Wafer Equipment | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | Gen3 |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF200 | SUSS MicroTec ACS300 Gen3 |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | — |
| Date of Manufacture | 1998[1] | — |
| Currently Configured for | 200mm[1] | — |
| Current Equipment Status | Available[1] | — |
| Available date | Currently Available[1] | — |
| Equipment category | Production Wafer Prober[1] | — |
| System type | — | Automated[2] |
| Max wafer size | — | 300 mm[2] |
| Process capabilities | — | Priming, Spin Coating, Baking, Aqueous / Solvent Developing[2] |