Comparison ledger
Accretech UF 200 A Automatic Wafer, Tenney , TPS JR-A-F4T Junior compact temperature test chambers, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 200 A Automatic WaferAccretech | |
|---|---|---|
| OEM | Accretech | Tenney |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 200 | Tenney , TPS JR-A-F4T Junior compact temperature test chambers |
| Cited variants |
| — |
| Specifications | ||
| Chuck | Gold[2] | — |
| Chuck temp | Hot[2] | — |
| Os Version | 3 G 05 EH[2] | — |
| Configuration | 3 G 05 EH[5] | — |
| Chuck material | Gold[6] | — |
| Chuck temperature | Hot[2] | — |
| OS Version | 3 G 05 EH 2007[2] | — |
| Vintage year | 2007[4] | — |
| Make | Accretech / TSK[2] | — |
| Model | UF 200 A[2] | JR-A-F4T[7] |
| Equipment Type | Automatic Wafer Prober[2] | — |
| Chamber Size | — | 1.2 cubic feet[7] |
| Temperature Range | — | -68°C to +180°C[7] |
| Control | — | +/-1.0°C[7] |
| Manufacturer | — | Tenney[7] |
| Short description | — | Junior compact temperature test chambers[7] |
| Control accuracy | — | +/-1.0°C[7] |
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