Comparison ledger
Accretech UF 200 Automatic Wafer, Tenney , TPS JR-A-F4T Junior compact temperature test chambers, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 200 Automatic WaferAccretech | |
|---|---|---|
| OEM | Accretech | Tenney |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 200 | Tenney , TPS JR-A-F4T Junior compact temperature test chambers |
| Specifications | ||
| Chuck | Gold[1] | — |
| Chuck Temp | Hot[1] | — |
| Os Version | 3 G 05 EH[1] | — |
| Wafer size | 8 inch[3] | — |
| Chuck material | Gold[1] | — |
| Chuck temperature | Hot[1] | — |
| Operating system version | 3 G 05 EH[1] | — |
| Chuck temperature capability | Hot[1] | — |
| Make | Accretech / TSK[4] | — |
| Model | UF 200[4] | JR-A-F4T[5] |
| Equipment type | Automatic Wafer Prober[4] | — |
| Vintage | 1999[1] | — |
| Chamber Size | — | 1.2 cubic feet[5] |
| Temperature Range | — | -68°C to +180°C[5] |
| Control | — | +/-1.0°C[5] |
| Manufacturer | — | Tenney[5] |
| Short description | — | Junior compact temperature test chambers[5] |
| Control accuracy | — | +/-1.0°C[5] |
Plan your fab
Building a Test & Probe process? Get a complete equipment list.
Open the fab equipment planner →