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Comparison ledger

0010-13622 RF Match forversusUltima HDP

Applied Materials 0010-13622 RF Match for, Applied Materials Ultima HDP, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
Ultima HDPApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forApplied Materials Ultima HDP
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]Refurbished[2]
Model0010-13622[1]Ultima HDP[3]
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
OEM—Applied Materials[3]
Equipment type—Chemical vapor deposition (CVD) semiconductor manufacturing tool[3]
Process type—High-density plasma CVD[4]
Wafer size—200 mm and 300 mm systems[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]media-moov-co.s3.us-west-1.amazonaws.commedia-moov-co.s3.us-west-1.amazonaws.com