Comparison ledger
Applied Materials 0010-13622 RF Match for, CHA Mark 50, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Mark 50CHA |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | CHA Mark 50 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | updated to control the deposition and chambers.[2] |
| Model | 0010-13622[1] | Mark 50[3] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Process type | — | Physical Vapor Deposition (PVD)[3] |
| Wafer size | — | 6 inch[3] |
| Deposition type | — | Thin-film deposition[4] |
| Control upgrade | — | Computer added to track processes[2] |
| Power supply upgrade | — | New Glassman voltage supply[2] |
| Controller upgrade | — | Updated Infinicon controller[2] |
| OEM | — | CHA[3] |
| Equipment type | — | PVD (Physical Vapor Deposition)[3] |
| Wafer sizes | — | 6 inch[3] |
| Process update | — | Updated to control the deposition and chambers[2] |
| Control/process additions | — | Computer added to track processes[2] |
| Voltage unit | — | New Glassman voltage[2] |
| Measurement unit | — | Updated Inficon[2] |
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