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0010-13622 RF Match forversusDesk II

Applied Materials 0010-13622 RF Match for, Denton Vacuum Desk II, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
Desk IIDenton Vacuum
OEMApplied MaterialsDenton Vacuum
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forDenton Vacuum Desk
Cited variants—
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[2]Metal[3]
Model0010-13622[2]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[2]—
FeatureHigh Efficiency HE RF Match-Bias[2]—
Weight—103 lbs[1]
Dimensions—21 x 21 x 24 inches[1]
Electrical—115V/220V 50/60 Hz[1]
Argon gas requirement—5 psig, 99.99% purity[1]
Turbomolecular pump speed—100 lps[1]
Ultimate vacuum—10-6 Torr[1]
Mechanical pump speed—60 lpm[1]
Chamber diameter—6 inches[1]
Wafer size—8 inch[3]
Available targets—Gold, Gold/Palladium (60:40), Chromium[4]
Carbon evaporation accessory—Available[4]
Cycle time—Less than 5 minutes[1]
Pump type—100 lps turbomolecular pump, direct drive internal mechanical pump[1]
Gas requirement—Argon, 5 psig; 99.99% purity[1]
Chamber—Interchangeable six-inch diameter Pyrex chamber[1]
Targets—Gold, Gold/Palladium (60:40) and Chromium targets are available[4]
Coating materials—Au, AuPd, Cr, Pt, etc.[1]
Modes of operation—Cold sputter mode and etch mode standard[1]
Timer—Digital timer readout; timer automatically shuts off sputtering system after 999 seconds in manual mode[1]
Gauges—Solid state electronic bar graphs for gas pressure and electrical current; LED vacuum and current gauges[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]nanolab.ucla.edunanolab.ucla.edu