Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusCentura eMXP+

Applied Materials 0010-16392 ESC Assembly, Applied Materials Centura eMXP+, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
Centura eMXP+Applied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyApplied Materials Centura
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]—
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Configuration—Oxide[3]
Software Version—E4.8_26[3]
Voltage—208 VAC[3]
Full load current—240A[3]
Frequency—50/60 Hz[3]
Process—Nitride Spacer[3]
Wafer size—8 inch[3]
Robot—HP+ Robot[3]
Excludes—LPT, Chiller, Dry Pump[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]inventory listing