Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusTCP 9600 Metal

Applied Materials 0010-16392 ESC Assembly, Lam Research TCP 9600 Metal, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
TCP 9600 MetalLam Research
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyLam Research TCP 9600
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]—
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Configuration—SMIF[3]
Supported wafer sizes—150mm (6 inch) and 200mm[4]
Process pressure range—0 - 100 mTorr[5]
Top electrode power—0 - 1250 W[5]
Lower electrode power—0 - 1200 W[5]
Process temperature—55 °C[5]
Process gases—Cl2, BCl3, HBr, SF6, CF4, Ar, N2, O2, He[5]
Endpoint detection—Adjustable monochromator[5]
Wafer clamp—Electrostatic chuck (ESC) with helium backside cooling[6]
Electrode gap—Fixed gap 8 inch TCP coil[6]
Number of RF generators—3 (AE RFG 1250)[6]
Power supply requirements—208V, 80A, 3-Phase, 50/60Hz[6]
DSQ strip module—Included[5]
Software version—Envision 1.6.1-012[6]
Aluminum etch rate—> 8000 Å/min[4]
Aluminum non-uniformity—+/- 15%[4]
System uptime—Typically > 85%[4]
Mean time to change (MTTC)—12 hours[4]
Mean time between failures (MTBF)—> 125 hours[4]
Mean time to repair (MTTR)—< 4 hours[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (7)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]inventory listing
  4. [4]semigroup.comsemigroup.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]solutions-on-silicon.comsolutions-on-silicon.com
  7. [7]waferpedia.comwaferpedia.com