Comparison ledger
Applied Materials 0010-21246 Part, Mattson Aspen III, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-21246 PartApplied Materials | Aspen IIIMattson |
|---|---|---|
| OEM | Applied Materials | Mattson |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Mattson Aspen |
| Cited variants | — | |
| Specifications | ||
| Configuration | — | Low K[3] |
| Wafer size | — | 8 inch[3] |
| Wafer sizes (Highlands) | — | 200 / 300 mm[1] |
| Wafer sizes (CVD) | — | 200 / 300 mm bridge tool[2] |
| Process technology (Highlands) | — | Proprietary ICP technology[1] |
| Processing capability (Highlands) | — | Dual-wafer processing[1] |
| Design (Highlands) | — | Modular design allowing process modules to be added[1] |
| Throughput (CVD) | — | Up to 180 wafers per hour[2] |
| Deposited films (CVD) | — | Silane-based films (oxide, oxynitride, nitride) and TEOS-based oxide films[2] |
| Bridge capability (CVD) | — | Same process chamber can process either 200mm or 300mm wafers[2] |