Waferpedia

Comparison ledger

0010-21246 PartversusPiXDRO LP 30 Inkjet

Applied Materials 0010-21246 Part, SUSS MicroTec PiXDRO LP 30 Inkjet, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
PiXDRO LP 30 InkjetSUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—SUSS MicroTec PiXDRO
Specifications
Configuration—System accuracy < 5 µm (3σ)[1]
Temperature—Table temperature up to 50 °C[1]
System accuracy—< 5 µm (3σ)[1]
Printable area—327 × 227 mm (A4)[1]
Max substrate thickness—25 mm[1]
Table temperature—up to 50 °C[1]
Max motion speed—250 mm/s[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing