Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, CEE 1300 X Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | CEE |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | CEE 1300 X Hot Plate |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Configuration | — | Vacuum and exhaust[3] |
| Wafer Sizes | — | 3, 4, 5, 6, 8 inch[3] |
| Vacuum and Exhaust | — | Yes[3] |
| Programmable Bake Process | — | Up to 250,000 bake processes; unlimited steps per program[3] |
| Lift Pin | — | Yes[3] |
| Operation Modes | — | Contact, vacuum contact, nitrogen purge, proximity[3] |