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0010-22161 High EFF RF MatchversusCM 300 xi

Applied Materials 0010-22161 High EFF RF Match, FormFactor CM 300 xi, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
CM 300 xiFormFactor
OEMApplied MaterialsFormFactor
Category——
Wafer size——
Process node——
Introduced——
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FamilyApplied Materials 0010-22161 High EFF RF MatchFormFactor CM 300 xi
Cited variants—
Specifications
MakeApplied Materials[2]—
Model0010-22161[2]CM 300 xi[4]
DescriptionHTESC PH 1 REV A[3]—
ConditionUsed[3]—
Stock NumberBM6628[3]—
OEM—FormFactor[4]
Product type—300 mm semi-/fully-automated probe system[5]
Wafer size—300 mm[5]
Automation—Semi-automated and fully-automated[5]
Contact Intelligence—Supported[5]
Wafer handling capacity—Up to fifty 200 mm or 300 mm wafers[5]
Cassette type—SEMI-standard wafer cassettes[5]
Optional alignment feature—ReAlign off-axis probe-to-pad alignment[5]
Temperature range—-60°C to +300°C[5]
MicroChamber environment—EMI-shielded, light-tight and moisture-free test environment[5]
Variant designation—CM300xi-ULN[1]
ULN product type—300 mm probe station for ultra low noise measurements[1]
Sources (5)Every fact above is drawn from these public sources
  1. [1]formfactor.comformfactor.com
  2. [2]Equipment inventory listing
  3. [3]tarasemi.comtarasemi.com
  4. [4]Equipment inventory listing
  5. [5]formfactor.comformfactor.com