Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Lam Research TCP 9400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | TCP 9400Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 1996– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Lam Research TCP 9400 |
| Cited variants | — |
|
| Specifications | ||
| Make | Applied Materials[2] | — |
| Model | 0010-22161[2] | — |
| Description | HTESC PH 1 REV A[3] | — |
| Condition | Used[3] | — |
| Stock Number | BM6628[3] | — |
| Etch Technology | — | Transformer Coupled Plasma (TCP)[4] |
| RF Frequency | — | 13.56 MHz[4] |
| Number of RF Power Supplies | — | 2[4] |
| Maximum Etch Depth | — | 3 µm[4] |
| Primary Materials Etched | — | Silicon[4] |
| Other Materials Etched | — | Silicon Germanium, Germanium[4] |
| Gases | — | Chlorine, He/O2, Helium, Hydrogen Bromide, Nitrogen, Oxygen, Perfluoroethane, Tetrafluoromethane[4] |
| Substrate Sizes (SNF configuration) | — | 4 inch[4] |
| Substrate Sizes (standard configuration) | — | 8 inch[5] |
| Maximum Wafer Load | — | 25 wafers[4] |
| Transport System | — | Cassette to cassette[1] |
| Software | — | Envision version 1.4[1] |
| Vintage Year | — | 1996[1] |
| Platform | — | Rainbow[1] |
| Vacuum Pump | — | Leybold TURBOVAC 1000C[1] |
| Chamber Type | — | Ceramic free with waferless auto clean (WAC)[1] |
| Configuration | — | Single chamber stand-alone[1] |
| Inductively Coupled Source | — | TCP 9400 ESC[1] |
| CE Certified | — | Yes[1] |