Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM Eagle 60, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | Eagle 60ASM |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2002– |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2002 launch |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | ASM Eagle 60 |
| Specifications | ||
| Configuration | Refurbished[1] | 50/60 Hz[2] |
| Voltage | — | 240 V[2] |
| Phase | — | 1 Phase[2] |
| Frequency | — | 50/60 Hz[2] |
| Minimum bond pitch | — | 35 micron[3] |
| Wire type | — | Gold[3] |
| Productivity improvement | — | 20% higher than predecessor[3] |
| Wire bonding type | — | Gold wire bonding[3] |
| Fine pitch capability | — | 35 microns[3] |
| Equipment type | — | Wire Bonder[2] |
| Make | — | ASM[2] |
| Model | — | Eagle 60[2] |
| Power | — | 240 V, 50/60 Hz, 1 Phase[2] |
| Bonding capability | — | 35-micron fine pitch bonding[3] |
| Productivity | — | 20-percent higher productivity than its predecessor model[3] |
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