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0010-47763 ASSY ESC Bonded Monopolar Dual Heatedversus510

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, EV Group 510, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
510EV Group
OEMApplied MaterialsEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedEV Group 510
Specifications
ConfigurationRefurbished[1]230 / 400 V[2]
Power Consumption—13,2 kW[2]
Full Load Current Rating—24,7 A[2]
Largest Current Rating—24,7 A[2]
Vacuum Pump—Edwards nXD 56 i Scroll Pump[2]
Manufacturer—EV Group[3]
Model—510[2]
Equipment type—Bonder[4]
Power supply—230 / 400 V[2]
Frequency—50/60 Hz[2]
Maximum contact force—10 kN[3]
Heater size—150 mm and 200 mm[3]
Vacuum—Standard: 0.1 mbar; Optional: 1E-5 mbar[3]
Maximum temperature—550 °C[3]
Single chips processing—Yes[3]
Power supply for anodic bonding—Max. voltage: 2 kV; Max. current: 50 mA[3]
Loading chamber—Manual[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]evgroup.comevgroup.com
  4. [4]waferpedia.comwaferpedia.com