Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusAsymtek X 1020

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Nordson Asymtek X 1020, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsNordson
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedNordson Asymtek
Specifications
ConfigurationRefurbished[1]180-260 Volts[2]
Type—Fluid Dispenser[3]
Dispensing Technology—Jet, Needle, or Spray[3]
Control System—Windows-based software[3]
Accuracy—±25 μm[3]
Resolution—1 μm[3]
Fluid Types—Solder paste, adhesives, encapsulants, underfill[3]
Air Pressure Requirements—80 psi (5.5 bar)[3]
Power—180-260 Volts[2]
Max Current—30A[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]easymanua.lseasymanua.ls