Waferpedia

Comparison ledger

0020 17484 PartversusAxcela

Applied Materials 0020 17484 Part, Applied Materials Axcela, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
0020 17484 PartApplied Materials
AxcelaApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17484 PartApplied Materials Axcela
Specifications
ConfigurationBar, Cap Bank, Hdpcvd 300mm Ultima X[1]7 System[2]
Tables—5 x 300 mm (no backside)[2]
Wafer size capability—150mm, 200mm, 300mm[3]
Film thickness uniformity—< 2%[3]
Maximum film thickness—8 µm[3]
Maximum chambers—4[3]
Process type—Physical Vapor Deposition (PVD)[4]
OEM—Applied Materials[2]
Model—Axcela[2]
Wafer sizes—8, 12 inch[2]
Wafer diameter processing—150/200/300mm[3]
Chambers—4 chambers max[3]
Thickness uniformity—<2%[3]
Interfaces—SECS/GEM, GEM 300[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]semi-net.comsemi-net.com
  4. [4]waferpedia.comwaferpedia.com