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Comparison ledger

0020 17484 PartversusEndura 5500 IMP

Applied Materials 0020 17484 Part, Applied Materials Endura 5500 IMP, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0020 17484 PartApplied Materials
Endura 5500 IMPApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17484 PartApplied Materials Endura 5500
Specifications
ConfigurationBar, Cap Bank, Hdpcvd 300mm Ultima X[1]No SMIF Interface2 x OD[2]
Software Version—B8.01[2]
Wafer Type—Notch[2]
Line Frequency—50 Hz[2]
Line Voltage—200-208 V[2]
Line Amperage—320 A[2]
Make—Applied Materials[2]
Model—Endura 5500 IMP[2]
Category—Deposition[3]
Wafer Sizes—8 inch[2]
PVD type—Physical Vapor Deposition[3]
No SMIF Interface—2 x OD[2]
Vacuum—CTI 9600 Cryo compressor (2)[3]
Chamber A—Pre-Clean Chambers[2]
Chamber B—Cool Down Chamber[2]
Chamber C—Chamber C[2]
Chamber D—Chamber D[2]
Chamber E—Degas/Orienter Chamber[2]
Chamber F—Degas/Orienter Chamber[2]
Chamber 1—Chamber Process: PC II[2]
Chamber 2—Chamber Process: IMPTiN; Rough Pump Not Included[2]
Chamber 3—Chamber Process: IMPTiN; Rough Pump Not Included[2]
Buffer Chamber—Robot: HP 2000 Vintage[2]
Chamber 1 process—IMPTiN[2]
Chamber 2 process—IMPTiN[2]
Chamber 3 process—IMPTiN[2]
Loadlock Type—Wide Body L/L[2]
Chamber Process—PC II[2]
Robot—HP[2]
Manufacturer—Applied Materials[2]
Wafer size—8 inch[2]
SMIF interface—No SMIF Interface[2]
Electrical line frequency—50 Hz[2]
Electrical line voltage—200-208 V[2]
Electrical line amperage—320 A[2]
Buffer chamber robot—HP 2000 Vintage[2]
Chamber process—PC II; IMPTiN[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com