Comparison ledger
Applied Materials 0020 17484 Part, Varian CC2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 17484 PartApplied Materials | CC2Varian |
|---|---|---|
| OEM | Applied Materials | Varian |
| Category | Deposition | Deposition |
| Wafer size | — | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 17484 Part | Varian CC2 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Bar, Cap Bank, Hdpcvd 300mm Ultima X[2] | — |
| manual listed | — | Varian CC2 Manual[3] |
| film deposition type | — | sputter deposition of metals, alloys, and insulating thin films[3] |
| stage diameter | — | 6" diameter stage[3] |
| co-sputter capability | — | co sputter capable[3] |
| reactive sputtering | — | available (Nitrogen or Oxygen)[3] |
| Model | — | CC2 (senTorr CC2)[3] |
| Part Number | — | L91213020000[1] |
| OEM | — | Varian[1] |
| Process | — | Sputter deposition of metals, alloys, and insulating thin films[3] |
| Film thickness | — | Controllable from a few nm to hundreds of nm[3] |
| Cathodes | — | Three 3-inch diameter confocal cathodes[3] |
| Power supplies | — | 2 RF power supplies and a switchable DC power supply[3] |
| Co-sputter capability | — | Yes[3] |
| Reactive sputtering | — | Available with nitrogen or oxygen[3] |
| Stage diameter | — | 6-inch diameter stage[3] |
| Substrate rotation | — | +/- 10% uniformity[3] |
| Vacuum system | — | Cryo and turbo pumped to 1 x 10^7 Torr[3] |
| Substrate heat | — | Up to 200 C[3] |
| Liftoff deposition | — | Supported with sputter power[3] |
| Argon pressure range | — | 3-15 mT[3] |
| MFC controller | — | 200 sccm MFC controller, no APC valve[3] |
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