Waferpedia

Comparison ledger

0020 18698 PartversusPN: SF PAMC 300 M EC IT Copper Plating Anode

Applied Materials 0020 18698 Part, Applied Materials PN: SF PAMC 300 M EC IT Copper Plating Anode, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
0020 18698 PartApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18698 PartApplied Materials PN: SF PAMC 300 M EC IT Copper Plating Anode
Specifications
ConfigurationDial Cover, Side Local Match, Hdpcvd, Ul[1]300 mm[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing