Waferpedia

Comparison ledger

0020 23839 PartversusThermal

Applied Materials 0020 23839 Part, Denton Vacuum Thermal, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
ThermalDenton Vacuum
OEMApplied MaterialsDenton Vacuum
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartDenton Vacuum Thermal
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]Diffusion Pump[2]
Pump type—Diffusion Pump, Roughing Pump[2]
Deposition sources—Four sources: two for boats and two for wire materials[3]
Sample rotation control—Equipped[3]
Number of metals deposited sequentially (max)—4[3]
E-beam source (as related model)—4-pocket electron beam evaporation source[4]
Substrate size (related model)—Handles up to one 4" diameter substrate[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]tmi.utexas.edutmi.utexas.edu
  4. [4]nanocenter.umd.edunanocenter.umd.edu