Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 510, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 510EV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 510 |
| Specifications | ||
| Configuration | — | 230 / 400 V[1] |
| Power Consumption | — | 13,2 kW[1] |
| Full Load Current Rating | — | 24,7 A[1] |
| Largest Current Rating | — | 24,7 A[1] |
| Vacuum Pump | — | Edwards nXD 56 i Scroll Pump[1] |
| Manufacturer | — | EV Group[2] |
| Model | — | 510[1] |
| Equipment type | — | Bonder[3] |
| Power supply | — | 230 / 400 V[1] |
| Frequency | — | 50/60 Hz[1] |
| Maximum contact force | — | 10 kN[2] |
| Heater size | — | 150 mm and 200 mm[2] |
| Vacuum | — | Standard: 0.1 mbar; Optional: 1E-5 mbar[2] |
| Maximum temperature | — | 550 °C[2] |
| Single chips processing | — | Yes[2] |
| Power supply for anodic bonding | — | Max. voltage: 2 kV; Max. current: 50 mA[2] |
| Loading chamber | — | Manual[2] |
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