Waferpedia

Comparison ledger

0041-39086 ESC PartversusCentura DPS Poly

Applied Materials 0041-39086 ESC Part, Applied Materials Centura DPS Poly, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
Centura DPS PolyApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Applied Materials Centura DPS Poly
Cited variants—
  • Centura DPS IIDPS II[1]
Specifications
Wafer Size—6 inch[2]
Tool Type—Poly Etcher[2]
Plasma Source Type—Decoupled Plasma Source (DPS)[1]
RF Pulsing Frequency—1 kHz to 5 kHz[1]
Chamber Coating Material—Alumina or Y2O3[1]
Supported Process Node—28 nm[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]chinsortech.comchinsortech.com
  2. [2]Equipment inventory listing