Waferpedia

Comparison ledger

0720 06060 PartversusP 300 J Wafer

Applied Materials 0720 06060 Part, Micromanipulator P 300 J Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0720 06060 PartApplied Materials
P 300 J WaferMicromanipulator
OEMApplied MaterialsMicromanipulator
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0720 06060 PartMicromanipulator P 300 J Wafer
Specifications
ConfigurationContact Pin 24-20 Awg Crimp Gold Flash[1]—
Wafer size—300 mm[2]
Stage range—300 x 300 x 50 mm, theta 15 degrees[2]
Resolution—0.1 micron (stage, platen, microscope drive)[2]
Microscope drive range—100 x 100 mm (X-Y), 200 mm (Z)[2]
Station dimensions (W x D x H)—33 x 40 x 33 inches (84 x 102 x 84 cm)[2]
Station weight—480 lbs (218 kg)[2]
RMC-7 controller dimensions—17.8 x 19.7 x 5.5 inches (45.2 x 50 x 13.9 cm)[2]
RMC-7 controller weight—24 lbs (11 kg)[2]
Vacuum requirement—25 in-Hg[2]
Controller power input—85 to 265 VAC, 47-63 Hz, 2.4 Amps typical[2]
Temperature ranges (configurable)—Ambient to 300°C, 0°C to 300°C, -55°C to 300°C[3]
Platen material—Magnetic stainless steel[2]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]micromanipulator.commicromanipulator.com
  3. [3]mercia-semiconductor.commercia-semiconductor.com