Waferpedia

Comparison ledger

0720 06060 PartversusB 1120 M Burn-In

Applied Materials 0720 06060 Part, SSEC B 1120 M Burn-In, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0720 06060 PartApplied Materials
OEMApplied MaterialsSSEC
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0720 06060 PartSSEC B 1120 M Burn-In
Specifications
ConfigurationContact Pin 24-20 Awg Crimp Gold Flash[1]—
Make—SSEC[2]
Model—B 1120 M[2]
Equipment type—Burn-In[2]
Wafer size—8 inch[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing