Waferpedia

Comparison ledger

8100 Xversus200 ACU

Applied Materials 8100 X, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
8100 XApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 8100 XAxcelis NV GSD 200
Specifications
CategoryEtch[1]—
Wafer size4 inch[2]200mm[5]
Configuration—Parts Machine[3]
Manufacturer—Axcelis[3]
Model—200 ACU[3]
Tool type—Asher[3]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com