Waferpedia

Comparison ledger

Centura 4.0 Radiance RTPversus0332 F 9453 302 Diffusion

Applied Materials Centura 4.0 Radiance RTP, Varian 0332 F 9453 302 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
Centura 4.0 Radiance RTPApplied Materials
OEMApplied MaterialsVarian
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura 4.0 Radiance RTPVarian 0332 F 9453 302 Diffusion
Specifications
ManufacturerApplied Materials[1]—
ModelCentura 4.0 Radiance[2]0332 F 9453 302[4]
System typeRapid Thermal Process[1]—
CategoryThermal / Diffusion[1]Thermal / Diffusion[6]
Vintage2002[2]—
Version300 mm[3]—
Asset Number—142841[4]
Last Confirm Date—October 14, 2025[5]
Make—Varian[4]
Tool type—diffusion pump[6]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]Equipment inventory listing
  5. [5]fab-spares.comfab-spares.com
  6. [6]waferpedia.comwaferpedia.com