Waferpedia

Comparison ledger

Centura 5200 Dryversus200 ACU

Applied Materials Centura 5200 Dry, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura 5200 DryApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura 5200Axcelis NV GSD 200
Specifications
Configuration50/60 Hz[1]Parts Machine[3]
Voltage208V[1]—
Process typeDry etching[1]—
Wafer size8 inch[1]200mm[5]
Wafer size (version)200 mm[2]—
Electrical: frequency50/60 Hz[1]—
Electrical: voltage208V[1]—
Electrical: current240A[1]—
Chamber configuration2 Chamber dps Metal, 2 Chamber asp+[2]—
Manufacturer—Axcelis[3]
Model—200 ACU[3]
Tool type—Asher[3]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com