Waferpedia

Comparison ledger

Centura 5300 Omega HDP Dryversus200 ACU

Applied Materials Centura 5300 Omega HDP Dry, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials CenturaAxcelis NV GSD 200
Specifications
2 chSiO2 D/E CH-A/B[1]—
ManufacturerApplied Materials[1]Axcelis[3]
ModelCentura 5300 Omega HDP[1]200 ACU[3]
Tool typeDry etcher[1]Asher[3]
Wafer size8 inch[1]200mm[5]
Configuration2 ch SiO2 D/E CH-A/B[2]Parts Machine[3]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com