Waferpedia

Comparison ledger

Mirra Integraversus12 Lapper

Applied Materials Mirra Integra, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
Mirra IntegraApplied Materials
12 LapperLapmaster
OEMApplied MaterialsLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones1999 Vintage year—
Control system——
Generation——
FamilyApplied Materials Mirra—
Specifications
ConfigurationPoly / STI[1]—
OEMApplied Materials[1]—
ModelMirra Integra[1]—
Equipment typeCMP (Chemical Mechanical Polisher)[1]—
Wafer size8 inch[1]—
Vintage1999[1]—
Application note8 inch - Poly / STI[1]—
Outside plate diameter—12 inches[2]
Lapping Speed Range—0 to 60 rpm[3]
Wafer Size Compatibility—4 inches or smaller[2]
Input Voltage—110 V[2]
Frequency—60 Hz[2]
Phase—1[2]
Number of Rings—3[2]
Number of Weights—3[2]
Includes Slurry System—Yes[2]
Includes Timer—Yes[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]jmind.comjmind.com
  3. [3]etd.ohiolink.eduetd.ohiolink.edu