Comparison ledger
Applied Materials Reflexion LK, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Reflexion LKApplied Materials | 12 LapperLapmaster |
|---|---|---|
| OEM | Applied Materials | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Reflexion | — |
| Specifications | ||
| Configuration | Miniship[1] | — |
| Wafer size | 300 mm[3] | — |
| Removal rate | >6452 Å/min[3] | — |
| Non-uniformity | <4%[3] | — |
| Pressure | 1.5 psi[3] | — |
| Slurry flow rate | 300 ml/min[3] | — |
| Platen/Carrier rotary speed | 97/103 rpm[3] | — |
| Gas delivery | 300 ml/min[1] | — |
| Manufacturer | Applied Materials[4] | — |
| Model | Reflexion LK[4] | — |
| Process | CMP (Chemical Mechanical Polisher)[4] | — |
| Outside plate diameter | — | 12 inches[5] |
| Lapping Speed Range | — | 0 to 60 rpm[6] |
| Wafer Size Compatibility | — | 4 inches or smaller[5] |
| Input Voltage | — | 110 V[5] |
| Frequency | — | 60 Hz[5] |
| Phase | — | 1[5] |
| Number of Rings | — | 3[5] |
| Number of Weights | — | 3[5] |
| Includes Slurry System | — | Yes[5] |
| Includes Timer | — | Yes[5] |