Comparison ledger
ASM AD 809 01, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AD 809 01ASM | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | ASM | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM AD 809 01 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Power Rating | 110 VAC 50/60 Hz[1] | — |
| Make | ASM[1] | — |
| Model | AD 809 01[1] | — |
| Equipment type | Die Bonder[1] | — |
| Vintage | 1997[1] | — |
| Wafer Size | — | 6 inch[3] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →