Waferpedia

Comparison ledger

AD 809 01versus10100

ASM AD 809 01, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM AD 809 01West Bond 10100
Specifications
Power Rating110 VAC 50/60 Hz[1]—
MakeASM[1]—
ModelAD 809 01[1]—
Equipment typeDie Bonder[1]—
Vintage1997[1]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing