Waferpedia

Comparison ledger

17099370 Outer strike plateversusE 500 EHP Medium Current

Axcelis 17099370 Outer strike plate, Varian E 500 EHP Medium Current, side by side. Every value shown is drawn from the cited encyclopedia entries.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
17099370 Outer strike plateAxcelis
E 500 EHP Medium CurrentVarian
OEMAxcelisVarian
CategoryIon ImplantationIon Implantation
Wafer size—Includes thin wafer handling kit
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis 17099370 Outer strike plateVarian E 500 EHP Medium Current
Specifications
ConfigurationUsed with Axcelis GSD 200[1]Can be converted to 8"[2]
Wafer size—Includes thin wafer handling kit[2]
Phase—3 Phase[2]
Voltage—208V[2]
17099370 Outer strike plate entryE 500 EHP Medium Current entryAsk about these tools →Share experience with this comparison →

Plan your fab

Building a Ion Implantation process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing