Comparison ledger
Axcelis 200 ACU, Lam Research 4520 XL, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | 4520 XLLam Research |
|---|---|---|
| OEM | Axcelis | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Lam Research Rainbow 4520 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Parts Machine[2] | PC functions but fan needs changing[6] |
| Manufacturer | Axcelis[2] | Lam Research[6] |
| Model | 200 ACU[2] | 4520 XL[6] |
| Tool type | Asher[2] | — |
| Wafer size | 200mm[4] | — |
| Serial number | AU6A356AH[4] | — |
| Computer system | M 200 PC, M 200[5] | — |
| Part number | SC 4572 A[5] | — |
| Volts | 208[5] | — |
| Amps | 30[5] | — |
| Equipment type | Asher[2] | — |
| Wafer configuration | 8 inch[3] | — |
| Software Version | — | E1.6.1-002[6] |
| Main UI (No PC Remote) | — | Pentium 33 NextStep[6] |
| Category | — | Etch[7] |
| Wafer sizes | — | 8 inch[6] |
| Main UI | — | Pentium 33 NextStep[6] |
| PC status | — | PC functions but fan needs changing[6] |
| Process application | — | Contact etch, planarization, via etch, trench mask etch, pad etch[8] |
| Operating pressure | — | 30-200 mtorr[8] |
| Aspect ratio | — | 5:1 or greater[8] |
| Selectivity | — | ≥ 50:1 for contact and ≥ 30:1 for via etch[8] |
| BPSG etch rate | — | >8000 A/min[8] |
| TEOS etch rate | — | >6000 A/min[8] |
| Uniformity | — | +/- 7% 3σ[8] |
| Selectivity BPSG/TEOS to poly | — | > 30:1[8] |
| Particles | — | <0.06/cm2 at >0.3μm size[8] |
| Uptime | — | ≥ 85%[8] |
| MTTC | — | < 6 hours[8] |
| MTBF | — | ≥ 125 hours[8] |
| MTTR | — | ≤ 4 hours[8] |
| Feature | — | Multifrequency diode[8] |
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