Comparison ledger
Axcelis 200 ACU, Tegal 901, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | 901Tegal |
|---|---|---|
| OEM | Axcelis | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Tegal 901 |
| Specifications | ||
| Configuration | Parts Machine[1] | Poly[5] |
| Manufacturer | Axcelis[1] | — |
| Model | 200 ACU[1] | — |
| Tool type | Asher[1] | — |
| Wafer size | 200mm[3] | 3 inch, 100 mm to 150 mm[7] |
| Serial number | AU6A356AH[3] | — |
| Computer system | M 200 PC, M 200[4] | — |
| Part number | SC 4572 A[4] | — |
| Volts | 208[4] | — |
| Amps | 30[4] | — |
| Equipment type | Asher[1] | — |
| Wafer configuration | 8 inch[2] | — |
| Primary process | — | non-critical silicon nitride and photoresist trim[7] |
| Reactor type | — | wide gap RF diode reactor[7] |
| Temperature regime | — | low temperature plasma etch[7] |
| Wafer handling | — | no wafer clamps or electrostatic chucks[7] |
| Additional process | — | poly etching[5] |
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