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Comparison ledger

200 ACUversusSCCM Shin

Axcelis 200 ACU, Tokyo Electron SCCM Shin, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
SCCM ShinTokyo Electron
OEMAxcelisTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tokyo Electron SCCM Shin
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]SCCM Shin[5]
Tool typeAsher[1]TSP-30555SSS[7]
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
OEM—Tokyo Electron[5]
Category—Etch[6]
Vintage—2005[5]
Description—Oxide etcher with qty 3 chambers[7]
Version—300 mm[7]
Load ports—3[7]
Etch process chambers—3[7]
RF generator (top)—Daihen AGA-50B 60 MHz 5 kW[7]
RF generator (bottom)—Daihen WGA-50E 2 MHz 5 kW[7]
Other chamber component—Daihen DGP-120A2[7]
Gate valves—Vat gate valves[7]
Vacuum pumps—Shimadzu turbo pumps[7]
DC power supplies—Kyosan DC power supplies[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]Equipment inventory listing
  6. [6]waferpedia.comwaferpedia.com
  7. [7]fabsurplus.comfabsurplus.com