Waferpedia

Comparison ledger

200 ACUversusTrias 200 SPA

Axcelis 200 ACU, Tokyo Electron Trias 200 SPA, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Trias 200 SPATokyo Electron
OEMAxcelisTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tokyo Electron Trias 200 SPA
Cited variants—
  • TEL Trias 200 SPA (Dry Etch)[1]
  • TEL Trias 200 SPA (CVD)[2]
Specifications
ConfigurationParts Machine[3]—
ManufacturerAxcelis[3]—
Model200 ACU[3]—
Tool typeAsher[3]—
Wafer size200mm[5]—
Serial numberAU6A356AH[5]—
Computer systemM 200 PC, M 200[6]—
Part numberSC 4572 A[6]—
Volts208[6]—
Amps30[6]—
Equipment typeAsher[3]—
Wafer configuration8 inch[4]—
Wafer Size—300 mm[1]
Process Type—Dry Etch[1]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com