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GSD 200 E High Currentversus160 XP Ion

Axcelis GSD 200 E High Current, Varian 160 XP Ion, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
GSD 200 E High CurrentAxcelis
160 XP IonVarian
OEMAxcelisVarian
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis GSD 200 E High CurrentVarian 160 XP Ion
Specifications
Wafer size (variant 1)8 inch[1]—
Wafer size (variant 2)6 inch[2]—
TypeHigh Current Ion Implanter[1]—
Configuration—150mm High Current IMP[3]
OEM—Varian[4]
Model—160 XP Ion[4]
Category—Ion Implantation[3]
Tool type—ion implanter[3]
GSD 200 E High Current entry160 XP Ion entryAsk about these tools →Share experience with this comparison →

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing