Comparison ledger
Besi 2200 APM+ Die Attach, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10490West Bond | |
|---|---|---|
| OEM | Besi | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 | West Bond 10490 |
| Specifications | ||
| Configuration | Issue with the Injector[1] | — |
| OEM | Besi / Datacon[1] | — |
| Model | 2200 APM+[1] | 10490[3] |
| Machine type | Die Attach[1] | — |
| Description | High-accuracy multi-chip die bonder[2] | Convertible bonder, wedge to ball[4] |
| Applications | Die attach; flip chip applications[2] | — |
| Wafer handling | 12 in[2] | — |
| Options/features | Integrated dispenser; automatic tool changer; application specific tooling[2] | — |
| Vintage | 2001[2] | — |
| Manufacturer | — | West Bond[3] |
| Tool type | — | Convertible bonder[5] |
| Bonding modes | — | Wedge bonding and ball bonding[5] |
| Use | — | Wire bonding[5] |
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