Waferpedia

Comparison ledger

18 D Surfaceversus321

Blanchard 18 D Surface, Disco 321, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
321Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco 321
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]—
Model18 D[2]321[4]
Asset #153970[1]—
Power416 V, 3 phase[2]—
OEM—Disco[4]
Equipment type—Wafer Dicing Saw[4]
Facility context—Cleanroom Instrumentation[4]
Application area—Nano and Micro Fabrication[4]
Location—FNT 4.106[4]
Wafer Size—Up to 6 inches[5]
Spindle Power—1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[6]
Spindle Power (alternate)—1500 Watt spindle[5]
Non-Contact Setup—Non Contact Setup[6]
Microscope—Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[6]
Broken Blade Detection—Broken Blade Detection[6]
Light Tower—Includes Light Tower[6]
Chuck Type—6" Universal Chuck (or 6" Porous Film Frame Chuck)[5]
Wafer size capability—Up to 6" wafers[6]
Chuck—6-inch porous film frame chuck[5]
Spindle power—1500-watt spindle[5]
Footprint—Small footprint[5]
Setup—Non-contact setup[6]
Blade break detection—Broken blade detection[6]
Other features—Floppy drive, light tower, blade tools, manuals[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]tmi.utexas.edutmi.utexas.edu
  5. [5]jmind.comjmind.com
  6. [6]gtsaz.comgtsaz.com