Waferpedia

Comparison ledger

18 D SurfaceversusDAD3241

Blanchard 18 D Surface, Disco DAD3241, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
DAD3241Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—up to Φ8”
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DAD3241
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[1]—
Power416 V, 3 phase[2]—
Max. workpiece size—Φ8”[4]
X-/Y-axis cutting range—210 mm[4]
Cutting speed—0.1-800 mm/s[4]
Index positioning accuracy—0.002/210 mm[4]
Z-axis max. stroke—32.2 mm[4]
Moving resolution—0.000002 mm[4]
Repeatability accuracy—0.001 mm[4]
Θ-axis max. rotating angle—320°[4]
Rotation speed range—6,000-60,000 rpm[4]
X-axis cutting range—210 mm[4]
Y-axis cutting range—210 mm[4]
Spindle rated output—1.8 kW at 60,000 min-1[6]
Spindle rated torque—0.29 N·m[6]
Equipment dimensions—650 × 950 × 1,670 mm[6]
Equipment weight—Approx. 550 kg[6]
Axis drive—Servo motors on all axes (X, Y, and Z)[5]
Interface—XIS (Extended Interface System)[5]
Microscope—Built-in microscope[4]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]aggiefab.tamu.eduaggiefab.tamu.edu
  5. [5]disco.com.sgdisco.com.sg
  6. [6]disco.co.jpdisco.co.jp