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Comparison ledger

18 D SurfaceversusDFD 6750 Fully Automatic Dicing

Blanchard 18 D Surface, Disco DFD 6750 Fully Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFD 6750 Fully Automatic Dicing
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[1]—
Power416 V, 3 phase[2]—
Max rotation diameter—340 mm[4]
Max jig size—300 x 160 mm (Applicable work size 280 × 140)[4]
X-axis Cutting range—300 mm[4]
Cutting speed—0.1 ~ 1,000 mm/s[4]
Y1・Y2 axis Cutting range—300 mm[4]
Index step—0.0001 mm[4]
Positioning accuracy—Within 0.003/660 (Single error), Within 0.002/5[4]
Z-axis Max stroke—19.2 mm (for Φ2 inch blade) / 19.9 mm (for Φ3 inch blade)[4]
Moving resolution—0.00005 mm[4]
Repeatability accuracy—0.001 mm[4]
θ-axis Max rotating angle—215 deg[4]
Spindle rated torque (1.8 kW)—0.29 N·m[4]
Spindle rated torque (2.2 kW)—0.7 N·m[4]
Rotation speed range (1.8 kW)—6,000 - 60,000 min⁻¹[4]
Rotation speed range (2.2 kW)—3,000 - 30,000 min⁻¹[4]
Equipment dimensions (W×D×H)—1,510 × 1,554 × 1,800 mm (excluding scrap box)[4]
Equipment weight—Approx. 2,200 kg[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]disco.co.jpdisco.co.jp