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Comparison ledger

18 D SurfaceversusDFL 7160 Automatic

Blanchard 18 D Surface, Disco DFL 7160 Automatic, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFL 7160
Cited variants—
  • DFL 7160 Laser Dicing[1]
Specifications
Voltage416 V[2]—
Phase3 Phase[2]—
Cycles50[2]—
Control Voltage110[2]—
MakeBlanchard[3]—
Model18 D[3]—
Asset #153970[2]—
Power416 V, 3 phase[3]—
Configuration—1 Cassette port[5]
Wafer Size—12 inch[5]
Cassette Ports—1[5]
Dicing—Yes[6]
Circular Ring Cutting of Taiko Wafers—Yes[6]
Automation—Automatic[1]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com