Waferpedia

Comparison ledger

18 D SurfaceversusDTG 8460 Taiko

Blanchard 18 D Surface, Disco DTG 8460 Taiko, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DTG 8460
Cited variants—
  • DTG 8460 Wafer Backside[1]
Specifications
Voltage416 V[2]208 V[6]
Phase3 Phase[2]200-2008 V, 50 A, 50/60 Hz, 3 Phase[5]
Cycles50[2]—
Control Voltage110[2]—
MakeBlanchard[3]—
Model18 D[3]—
Asset #153970[2]—
Power416 V, 3 phase[3]—
Configuration—3 Chucks[5]
Wafer size—12 inch[5]
Process type—Cassette to Cassette[5]
Number of chucks—3[5]
Current—50 A[5]
Frequency—50/60 Hz[5]
Add-on chiller—DTU 1531[5]
Accessories—USV, Duct Unit, Vacuum Unit[5]
Vintage year—2012[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com
  7. [7]tarasemi.comtarasemi.com