Waferpedia

Comparison ledger

20 36 Surfaceversus321

Blanchard 20 36 Surface, Disco 321, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
321Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco 321
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]—
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Typesurface grinder[1]—
Applicationdicing and grinding[2]—
Magnetic chuck controlElectro-Matic Neutrol II Magnetic Chuck Control[2]—
Condition notelow hours[1]—
OEM—Disco[3]
Model—321[3]
Equipment type—Wafer Dicing Saw[3]
Facility context—Cleanroom Instrumentation[3]
Application area—Nano and Micro Fabrication[3]
Location—FNT 4.106[3]
Wafer Size—Up to 6 inches[4]
Spindle Power—1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[5]
Spindle Power (alternate)—1500 Watt spindle[4]
Non-Contact Setup—Non Contact Setup[5]
Microscope—Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[5]
Broken Blade Detection—Broken Blade Detection[5]
Light Tower—Includes Light Tower[5]
Chuck Type—6" Universal Chuck (or 6" Porous Film Frame Chuck)[4]
Wafer size capability—Up to 6" wafers[5]
Chuck—6-inch porous film frame chuck[4]
Spindle power—1500-watt spindle[4]
Footprint—Small footprint[4]
Setup—Non-contact setup[5]
Blade break detection—Broken blade detection[5]
Other features—Floppy drive, light tower, blade tools, manuals[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]tmi.utexas.edutmi.utexas.edu
  4. [4]jmind.comjmind.com
  5. [5]gtsaz.comgtsaz.com