Waferpedia

Comparison ledger

20 36 SurfaceversusDFG 850 Back

Blanchard 20 36 Surface, Disco DFG 850 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DFG
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]Disco DVC 011 Vacuum Coolant Unit[3]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Typesurface grinder[1]—
Applicationdicing and grinding[2]—
Magnetic chuck controlElectro-Matic Neutrol II Magnetic Chuck Control[2]—
Condition notelow hours[1]—
Power—200-208 V, 50/60 Hz, 3 Phase[3]
Spindle Type—Air Bearings[3]
Maximum Spindle Speed—7,000 RPM[3]
External Cooling—Water Cooled[3]
Associated Coolant Unit—Disco DVC 011 Vacuum Coolant Unit[3]
Wafer Sizes—8 inch[4]
Vacuum Coolant Unit—Disco DVC 011[3]
OEM—Disco[4]
Model—DFG 850[4]
Equipment type—Back Grinder[4]
Related unit—Disco DVC 011 Vacuum Coolant Unit[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]Equipment inventory listing